Forced Convection upon Heat Sink of AL-Cu for Design Optimization by Experimental and CFD Analysis for Cooling of ICs in CPU
Srinivas. D1, S. Ramamurthy2, Juhi Ansari3

1Srinivas. D, Prof and Head mechanical engg,Research Scholar, JAIN, Bengaluru.
2S. Ramamurthy, Prof at R&D,CMET,JAIN,Bengaluru,
3Juhi Ansari, Asst prof,E&C,KCT Engg college, kalaburagi & Research scholar VTU, Belagavi, Karnataka..
Manuscript received on November 25, 2019. | Revised Manuscript received on December 08, 2019. | Manuscript published on December 30, 2019. | PP: 251-255 | Volume-9 Issue-2, December, 2019. | Retrieval Number: A9867109119/2019©BEIESP | DOI: 10.35940/ijeat.A9867.129219
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Abstract: A heat sink device is used with specific power input at 100V and 20W by the heater attached at the base plate of copper and then obtaining the average temperature of Heat sink by the help of 10 thermocouples .Two specimens of heat sinks were designed and were tested for mass flow rate and heat transfer coefficient. With base of 1.5mm&2.5mmtip thickness and another specimen with dimensions as tip0.5mm and1.00mmbase thickness are used By experimenting and CFD simulations,optimization of heat sink design was done.Then correlation and Validation foe both the specimen was done and were found satisfactory results.
Keywords: Base plate,Cooling fan, CFD simulation, Heat sink, Heat dissipation, IC’s ,Fin configuration, Thermocouples.