Heat Transfer at Microscales – Accomplishments and Oppurtunities
Nishit Bedi, Mechanical Engg. Department, Echelon Institute of Technology, Faridabad, India.
Manuscript received on July 12, 2013. | Revised Manuscript received on August 13, 2013. | Manuscript published on August 30, 2013. | PP: 126-131 | Volume-2, Issue-6, August 2013. | Retrieval Number: F1991082613/2013©BEIESP
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: The need for high removal of heat transfer rates yet lowering the dimensions demands for development of micro cooling techniques. In this regard many papers have been published in the recent past covering understanding the boiling mechanism, the effects of dimensions on flow boiling and attempt to enhance heat transfer. This paper presents the roadmap to cooling, difference between the conventional and the microchannels and the considerations which can affect the results significantly. Suggestions for efforts in specific areas in this field are also provided.
Keywords: Heat transfer, Scaling effects, Boiling, Microchannel.